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Product	Manufacturer	Package	Description	RoHS	Stock	Unit/USD	Quantity	Amount/USD
HSIB918-1	HSIB918-1 iBASE Technology - AC, HEAT SPREADER FOR IB918 SERI Price: - RFQ	iBASE Technology	-	AC, HEAT SPREADER FOR IB918 SERI		-	-
HSIBQ800-A	HSIBQ800-A iBASE Technology - HEAT SINK FOR IBQ800 (H052HSIBQ8 Price: - RFQ	iBASE Technology	-	HEAT SINK FOR IBQ800 (H052HSIBQ8		-	-
HS-M2-SSD-21	HS-M2-SSD-21 Gelid Solutions LLC - ICECAP M.2 SSD COOLING KIT Price: $12.0935	Gelid Solutions LLC	-	ICECAP M.2 SSD COOLING KIT		19	1 : $12.0935 10 : $11.41805 25 : $10.7464 50 : $10.07475 100 : $9.4031 250 : $8.73145 500 : $8.563528 1000 : $8.395625		$12.0935 $11.41805 $10.7464 $10.07475 $9.4031 $8.73145 $8.563528 $8.395625
825402B03400	825402B03400 Comair Rotron - HEATSINK STAMP 25.4X12.7X30MM Price: - RFQ	Comair Rotron	-	HEATSINK STAMP 25.4X12.7X30MM	-	-	-
833900T00000	833900T00000 Comair Rotron - HEATSINK STAMP 25.9X15X9.5MM Price: - RFQ	Comair Rotron	-	HEATSINK STAMP 25.9X15X9.5MM	-	-	-
834100T00000	834100T00000 Comair Rotron - HEATSINK STAMP 22.9X8X10.2MM Price: - RFQ	Comair Rotron	-	HEATSINK STAMP 22.9X8X10.2MM	-	-	-
HSE-B18318-0396H	HSE-B18318-0396H CUI Devices - HEAT SINK, EXTRUSION,TO-218, 31. Price: - RFQ	CUI Devices	-	HEAT SINK, EXTRUSION,TO-218, 31.		-	-
HSE-B18508-060H-W	HSE-B18508-060H-W CUI Devices - HEAT SINK, EXTRUSION,TO-218, 50. Price: - RFQ	CUI Devices	-	HEAT SINK, EXTRUSION,TO-218, 50.		-	-
HSE-B18635-0396H	HSE-B18635-0396H CUI Devices - HEAT SINK, EXTRUSION, TO-218, 63 Price: - RFQ	CUI Devices	-	HEAT SINK, EXTRUSION, TO-218, 63		-	-
HSE-B20250-040H-01	HSE-B20250-040H-01 CUI Devices - HEAT SINK, EXTRUSION, TO-220, 25 Price: $0.7885	CUI Devices	-	HEAT SINK, EXTRUSION, TO-220, 25		1281	1 : $0.7885 10 : $0.7486 25 : $0.71098 50 : $0.69236 100 : $0.682955 250 : $0.636158 500 : $0.598728 1000 : $0.542602 5000 : $0.523887		$0.7885 $0.7486 $0.71098 $0.69236 $0.682955 $0.636158 $0.598728 $0.542602 $0.523887