Interface
| Product | Manufacturer | Package | Description | RoHS | Stock | Unit/USD | Quantity | Amount/USD | |
 ZSSC3135BE1B | ZSSC3135BE1B IDT, Integrated Device Technology Inc - WAFER (UNSAWN) - BOX Price: - RFQ | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | - | - | - | ||
| ZSSC3136BE1D | ZSSC3136BE1D IDT, Integrated Device Technology Inc - DICE (WAFER SAWN) - WAFFLE PACK Price: - RFQ | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | - | - | - | ||
| ZSSC3224BI1B | ZSSC3224BI1B IDT, Integrated Device Technology Inc - WAFER (UNSAWN) - BOX Price: - RFQ | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | - | - | - | ||
| ZSSC3224BI1C | ZSSC3224BI1C Renesas - DICE (WAFER SAWN) - FRAME Price: - RFQ | Renesas | - | DICE (WAFER SAWN) - FRAME |  | - | - | ||
| ZSSC3230BC1B | ZSSC3230BC1B Renesas Die WAFER UNSAWN, 304 Price: - RFQ | Renesas | Die | WAFER UNSAWN, 304 | | - | - | ||
| ZSSC3230BC6B | ZSSC3230BC6B Renesas Die WAFER UNSAWN, 725U, WITH INKING Price: - RFQ | Renesas | Die | WAFER UNSAWN, 725U, WITH INKING | | - | - | ||
| ZSSC3230BC2B | ZSSC3230BC2B Renesas Die OPN - WAFER UNSAWN, 725 Price: - RFQ | Renesas | Die | OPN - WAFER UNSAWN, 725 | | - | - | ||
| ZSSC3230BI1DES | ZSSC3230BI1DES Renesas Die DICE (WAFER SAWN) - WAFFLE PACK Price: - RFQ | Renesas | Die | DICE (WAFER SAWN) - WAFFLE PACK | | - | - | ||
| ZSSC3240CC1C | ZSSC3240CC1C Renesas Die WAFER (SAWN) - FRAME Price: - RFQ | Renesas | Die | WAFER (SAWN) - FRAME | | - | - | ||
| ZSSC4165DE1D | ZSSC4165DE1D IDT, Integrated Device Technology Inc - DICE (WAFER SAWN) - WAFFLE PACK Price: - RFQ | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | - | - | - |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
