28-6554-18
Aries Electronics
Product No:
28-6554-18
Manufacturer:
Package:
-
Batch:
-
Description:
CONN IC DIP SOCKET ZIF 28POS
Quantity:
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In Stock : Please Inquiry
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Product Information
Parameter Info
User Guide
| Mfr | Aries Electronics |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Series | 55 |
| Package | Bulk |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | 0.100" (2.54mm) |
| Product Status | Active |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled |
| Contact Resistance | - |
| Base Product Number | 28-6554 |
| Contact Finish - Post | Nickel Boron |
| Current Rating (Amps) | 1 A |
| Operating Temperature | -55°C ~ 250°C |
| Contact Finish - Mating | Nickel Boron |
| Contact Material - Post | Beryllium Nickel |
| Termination Post Length | 0.110" (2.78mm) |
| Contact Material - Mating | Beryllium Nickel |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 50.0µin (1.27µm) |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
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2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
