Home / Heat Sinks / HSB03-121218

HSB03-121218

CUI Devices

Product No:

HSB03-121218

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, BGA, 12 X 12 X 18 MM

Quantity:

Payment Methods

wire transfer Paypal Alipay download1 paypal02

Delivery Methods

paypal03 paypal04 DHL2 sf1 UPS2 unnamed1 ems1

In Stock : 2268

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    0.8645

    0.8645

  • 10

    0.81985

    0.81985

  • 25

    0.77862

    0.77862

  • 40

    0.757862

    0.757862

  • 80

    0.747774

    0.747774

  • 230

    0.696512

    0.696512

  • 440

    0.655519

    0.655519

  • 2520

    0.594073

    0.594073

  • 5040

    0.573591

    0.573591

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Certif02 Certif07 Certif03 Certif04 Certif08 Certif10 Certif09 Certif05 Certif06

Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.472" (12.00mm)
Length 0.472" (12.00mm)
Series HSB
Package Tray
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 24.01°C/W
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM
Hot Sale