HSB03-121218
CUI Devices
Product No:
HSB03-121218
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 12 X 12 X 18 MM
Quantity:
Payment Methods
Delivery Methods
In Stock : 2268
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
0.8645
0.8645
10
0.81985
0.81985
25
0.77862
0.77862
40
0.757862
0.757862
80
0.747774
0.747774
230
0.696512
0.696512
440
0.655519
0.655519
2520
0.594073
0.594073
5040
0.573591
0.573591
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.472" (12.00mm) |
| Length | 0.472" (12.00mm) |
| Series | HSB |
| Package | Tray |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 24.01°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
Hot Sale
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
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