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HSB09-212115

CUI Devices

Product No:

HSB09-212115

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, BGA, 21 X 21 X 15 MM

Quantity:

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.827" (21.00mm)
Length 0.827" (21.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.591" (15.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 17.39°C/W
Power Dissipation @ Temperature Rise 4.3W @ 75°C
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 200 LFM
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