CUI Devices
Product No:
HSB09-212115
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 21 X 21 X 15 MM
Quantity:
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 0.827" (21.00mm) |
Length | 0.827" (21.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.591" (15.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 17.39°C/W |
Power Dissipation @ Temperature Rise | 4.3W @ 75°C |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 200 LFM |