HSB12-272706
CUI Devices
Product No:
HSB12-272706
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 27 X 27 X 6 MM
Quantity:
Payment Methods
Delivery Methods
In Stock : 1171
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
0.8455
0.8455
10
0.8018
0.8018
25
0.7619
0.7619
50
0.74195
0.74195
100
0.731975
0.731975
250
0.681834
0.681834
500
0.641706
0.641706
1000
0.581552
0.581552
5000
0.561498
0.561498
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.063" (27.00mm) |
| Length | 1.063" (27.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 19.59°C/W |
| Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 7.80°C/W @ 200 LFM |
Hot Sale
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
