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HSB21-454515

CUI Devices

Product No:

HSB21-454515

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, BGA, 45 X 45 X 15 MM

Quantity:

Payment Methods

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Delivery Methods

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In Stock : 380

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    2.0235

    2.0235

  • 10

    1.9703

    1.9703

  • 25

    1.9171

    1.9171

  • 50

    1.81051

    1.81051

  • 100

    1.70411

    1.70411

  • 250

    1.597558

    1.597558

  • 500

    1.54432

    1.54432

  • 1000

    1.384558

    1.384558

  • 5000

    1.35793

    1.35793

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.772" (45.00mm)
Length 1.772" (45.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.591" (15.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 7.56°C/W
Power Dissipation @ Temperature Rise 9.9W @ 75°C
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM
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