HSB28-606022
CUI Devices
Product No:
HSB28-606022
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 60 X 60 X 22 MM,
Quantity:
Payment Methods
Delivery Methods
In Stock : 79
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
6.2985
6.2985
10
6.09235
6.09235
25
5.91584
5.91584
50
5.56377
5.56377
100
5.000325
5.000325
250
4.929892
4.929892
500
4.612991
4.612991
1000
4.542558
4.542558
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 2.362" (60.00mm) |
| Length | 2.362" (60.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.866" (22.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Thermal Resistance @ Natural | 4.74°C/W |
| Power Dissipation @ Temperature Rise | 15.83W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 1.40°C/W @ 200 LFM |
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2000+Daily average RFQ Volume
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