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HSB28-606022

CUI Devices

Product No:

HSB28-606022

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, BGA, 60 X 60 X 22 MM,

Quantity:

Payment Methods

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Delivery Methods

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In Stock : 79

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    6.2985

    6.2985

  • 10

    6.09235

    6.09235

  • 25

    5.91584

    5.91584

  • 50

    5.56377

    5.56377

  • 100

    5.000325

    5.000325

  • 250

    4.929892

    4.929892

  • 500

    4.612991

    4.612991

  • 1000

    4.542558

    4.542558

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 2.362" (60.00mm)
Length 2.362" (60.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.866" (22.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Push Pin
Thermal Resistance @ Natural 4.74°C/W
Power Dissipation @ Temperature Rise 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow 1.40°C/W @ 200 LFM
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