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HSE-B1711-032

CUI Devices

Product No:

HSE-B1711-032

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, EXTRUSION, TO-220, 25

Quantity:

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.625" (16.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.354" (9.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Base Product Number HSE-B1711
Thermal Resistance @ Natural 20.27°C/W
Power Dissipation @ Temperature Rise 3.7W @ 75°C
Thermal Resistance @ Forced Air Flow 6.84°C/W @ 200 LFM
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