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HSE-B18635-035H

CUI Devices

Product No:

HSE-B18635-035H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, EXTRUSION,TO-218, 63.

Quantity:

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Delivery Methods

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In Stock : Please Inquiry

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Angled Fins
Width 1.638" (41.60mm)
Length 2.500" (63.50mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B18635
Thermal Resistance @ Natural 4.49°C/W
Power Dissipation @ Temperature Rise 16.7W @ 75°C
Thermal Resistance @ Forced Air Flow 2.24°C/W @ 200 LFM
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