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HSS12-B20-P95

CUI Devices

Product No:

HSS12-B20-P95

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Description:

HEAT SINK, STAMPING, TO-220, 19

Quantity:

Payment Methods

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Delivery Methods

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.748" (19.00mm)
Length 0.866" (22.00mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.433" (11.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 27.37°C/W
Power Dissipation @ Temperature Rise 2.7W @ 75°C
Thermal Resistance @ Forced Air Flow 10.90°C/W @ 200 LFM
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