PA0193-S

Chip Quik Inc.

Product No:

PA0193-S

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Description:

TSSOP-16-EXP-PAD STENCIL

Quantity:

Payment Methods

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Delivery Methods

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In Stock : Please Inquiry

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Product Information

Parameter Info
User Guide
Mfr Chip Quik Inc.
Type TSSOP
Pitch 0.026" (0.65mm)
Series Proto-Advantage PA
Package Bulk
Material Stainless Steel
Thickness 0.0040" (0.102mm)
Product Status Active
Inner Dimension 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions 16
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