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TS391SNL250

Chip Quik Inc.

Product No:

TS391SNL250

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Description:

THERMALLY STABLE SOLDER PASTE NO

Quantity:

Payment Methods

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Delivery Methods

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In Stock : 1

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    66.4525

    66.4525

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Product Information

Parameter Info
User Guide
Mfr Chip Quik Inc.
Form Jar, 8.8 oz (250g)
Type Solder Paste
Series -
Package Bulk
Process Lead Free
Diameter -
Flux Type No-Clean
Mesh Type 4
Shelf Life 12 Months
Wire Gauge -
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point 423 ~ 428°F (217 ~ 220°C)
Shipping Info -
Product Status Active
Shelf Life Start Date of Manufacture
Base Product Number TS391S
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
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