XR2D-4001-N
Omron Electronics Inc-EMC Div
Product No:
XR2D-4001-N
Manufacturer:
Package:
-
Batch:
-
Description:
CONN IC DIP SOCKET 40POS GOLD
Quantity:
Payment Methods
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In Stock : Please Inquiry
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Product Information
Parameter Info
User Guide
| Mfr | Omron Electronics Inc-EMC Div |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Series | XR2 |
| Package | Bulk |
| Features | Carrier |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | 0.100" (2.54mm) |
| Product Status | Obsolete |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Contact Resistance | 20mOhm |
| Contact Finish - Post | Gold |
| Current Rating (Amps) | 1 A |
| Operating Temperature | -55°C ~ 125°C |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Beryllium Copper |
| Termination Post Length | - |
| Contact Material - Mating | Beryllium Copper |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 29.5µin (0.75µm) |
| Contact Finish Thickness - Mating | 29.5µin (0.75µm) |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
Hot Sale
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
