Thermal
Product | Manufacturer | Package | Description | RoHS | Stock | Unit/USD | Quantity | Amount/USD | |
IW-HSKALU-CLASLR-SB04 | IW-HSKALU-CLASLR-SB04 iWave Systems - I.MX 8MMINI SBC HEATSINK Price: - RFQ | iWave Systems | - | I.MX 8MMINI SBC HEATSINK | - | - | |||
IW-HSKALU-CLASLR-SS01 | IW-HSKALU-CLASLR-SS01 iWave Systems - I.MX 6DL/S SODIMM SOM HEATSINK Price: - RFQ | iWave Systems | - | I.MX 6DL/S SODIMM SOM HEATSINK | - | - | |||
IW-HSKALU-CLASLR-CU03 | IW-HSKALU-CLASLR-CU03 iWave Systems - ZU+ MPSOC SOM MODULE HEATSINK Price: - RFQ | iWave Systems | - | ZU+ MPSOC SOM MODULE HEATSINK | - | - | |||
HSE-B18381-060H-W | HSE-B18381-060H-W CUI Devices - HEAT SINK, EXTRUSION, TO-218, 38 Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION, TO-218, 38 | - | - | |||
HSE-B1711-032 | HSE-B1711-032 CUI Devices - HEAT SINK, EXTRUSION, TO-220, 25 Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION, TO-220, 25 | - | - | |||
HSE-B1711-057 | HSE-B1711-057 CUI Devices - HEAT SINK, EXTRUSION, TO-220, 25 Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION, TO-220, 25 | - | - | |||
HSE-B18508-035H | HSE-B18508-035H CUI Devices - HEAT SINK, EXTRUSION, TO-218, 50 Price: $1.843 | CUI Devices | - | HEAT SINK, EXTRUSION, TO-218, 50 | 1345 | 1 : $1.843 10 : $1.7499 25 : $1.70392 50 : $1.65794 100 : $1.565885 250 : $1.473792 500 : $1.38168 1000 : $1.289568 5000 : $1.243512 | $1.843 | ||
HSE-B18381-0396H | HSE-B18381-0396H CUI Devices - HEAT SINK, EXTRUSION, TO-218, 38 Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION, TO-218, 38 | - | - | |||
HSE-B18635-035H | HSE-B18635-035H CUI Devices - HEAT SINK, EXTRUSION,TO-218, 63. Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION,TO-218, 63. | - | - | |||
HSE-B20250-040H | HSE-B20250-040H CUI Devices - HEAT SINK, EXTRUSION, TO-220, 25 Price: - RFQ | CUI Devices | - | HEAT SINK, EXTRUSION, TO-220, 25 | - | - |